Image


70T3319S133BF8

Die&wafer services

    Renesas Electronics America IncBranded70T3319S133BF8Integrated circuit electronic chips use1000Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70T3319S133BF8Chip inventory is11548individual。
---
 
Die&wafer services

70T3319S133BF8
查看芯片与晶圆服务型号为70T3319S133BF8，品牌为Renesas的大图  
 
70T3319S133BF8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3319S133BF8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11548
 Inquiry Now
Characteristic    
Minqty   1000
Series   IC SRAM 4.5MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
  •               Previous article
    AT28HC64B-90JI
    Microchip Technology
    EEPROM
  •               Next article
    24AA00&ST
    Microchip Technology
    EEPROM
    •  
     
    BRAND
     
  •  
    ON Semiconductor
    1
     
     
  •  
    XILINX
    2
     
     
  •  
    Analog Devices Inc
    3
     
     
  •  
    Microchip
    4
     
     
  •  
    BROADCOM
    5
     
     
  •  
    NXP Semiconductors
    6
     
     
  •  
    STMicroelectronics
    7
     
     
  •  
    Maxim
    8
     
     
  •  
    Silicon Labs
    9
     
     
  •  
    Texas Instruments
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd