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70T3319S133BC

Die&wafer services

    Renesas Electronics America IncBranded70T3319S133BCIntegrated circuit electronic chips use24Encapsulated, with a working temperature range of,The voltage is,use256-LBGAPackaging technology，now70T3319S133BCChip inventory is11394individual。
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Die&wafer services

70T3319S133BC
查看芯片与晶圆服务型号为70T3319S133BC，品牌为Renesas的大图  
 
70T3319S133BC     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3319S133BC
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11394
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Characteristic    
Minqty   24
Series   IC SRAM 4.5MBIT PAR 256CABGA
Packaging and Encapsulation   256-LBGA
Describe  
 
 
 
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