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70T3509MS133BP

Die&wafer services

    Renesas Electronics America IncBranded70T3509MS133BPIntegrated circuit electronic chips use18Encapsulated, with a working temperature range of,The voltage is,use256-BGAPackaging technology,now70T3509MS133BPChip inventory is16752individual。
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Die&wafer services

70T3509MS133BP

查看芯片与晶圆服务型号为70T3509MS133BP,品牌为Renesas的大图  
 
70T3509MS133BP     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3509MS133BP
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   16752
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Characteristic    
Minqty   18
Series   IC SRAM 36MBIT PAR 256CABGA
Packaging and Encapsulation   256-BGA
Describe  
 
 
 
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