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70T3319S133BFGI

Die&wafer services

    Renesas Electronics America IncBranded70T3319S133BFGIIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70T3319S133BFGIChip inventory is12250individual。
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Die&wafer services

70T3319S133BFGI
查看芯片与晶圆服务型号为70T3319S133BFGI，品牌为Renesas的大图  
 
70T3319S133BFGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3319S133BFGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   12250
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Characteristic    
Minqty   21
Series   IC SRAM 4.5MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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