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70T3319S133BFI8

Die&wafer services

    Renesas Electronics America IncBranded70T3319S133BFI8Integrated circuit electronic chips use1000Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70T3319S133BFI8Chip inventory is10211individual。
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Die&wafer services

70T3319S133BFI8
查看芯片与晶圆服务型号为70T3319S133BFI8，品牌为Renesas的大图  
 
70T3319S133BFI8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3319S133BFI8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   10211
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Characteristic    
Minqty   1000
Series   IC SRAM 4.5MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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