Image


70V639S12BFI

Die&wafer services

    Renesas Electronics America IncBranded70V639S12BFIIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V639S12BFIChip inventory is10176individual。
---
 
Die&wafer services

70V639S12BFI
查看芯片与晶圆服务型号为70V639S12BFI，品牌为Renesas的大图  
 
70V639S12BFI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V639S12BFI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   10176
 Inquiry Now
Characteristic    
Minqty   21
Series   IC SRAM 2.25MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
  •               Previous article
    CY7C2665KV18-550BZI
    Infineon Technologies
    SRAM - 同步，QDR II+...
  •               Next article
    AT29C020-90TU
    Microchip Technology
    闪存
    •  
     
    BRAND
     
  •  
    Texas Instruments
    1
     
     
  •  
    Silicon Labs
    2
     
     
  •  
    Microchip
    3
     
     
  •  
    Maxim
    4
     
     
  •  
    ALTERA
    5
     
     
  •  
    Analog Devices Inc
    6
     
     
  •  
    ON Semiconductor
    7
     
     
  •  
    XILINX
    8
     
     
  •  
    NXP Semiconductors
    9
     
     
  •  
    STMicroelectronics
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd