Image


70V639S12BF

Die&wafer services

    Renesas Electronics America IncBranded70V639S12BFIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V639S12BFChip inventory is14674individual。
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Die&wafer services

70V639S12BF
查看芯片与晶圆服务型号为70V639S12BF，品牌为Renesas的大图  
 
70V639S12BF     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V639S12BF
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   14674
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Characteristic    
Minqty   21
Series   IC SRAM 2.25MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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