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70V639S12BFGI8

Die&wafer services

    Renesas Electronics America IncBranded70V639S12BFGI8Integrated circuit electronic chips use1000Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V639S12BFGI8Chip inventory is15593individual。
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Die&wafer services

70V639S12BFGI8
查看芯片与晶圆服务型号为70V639S12BFGI8，品牌为Renesas的大图  
 
70V639S12BFGI8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V639S12BFGI8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   15593
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Characteristic    
Minqty   1000
Series   IC SRAM 2.25MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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