Image


70T3399S166BC

Die&wafer services

    Renesas Electronics America IncBranded70T3399S166BCIntegrated circuit electronic chips use24Encapsulated, with a working temperature range of,The voltage is,use256-LBGAPackaging technology，now70T3399S166BCChip inventory is15664individual。
---
 
Die&wafer services

70T3399S166BC
查看芯片与晶圆服务型号为70T3399S166BC，品牌为Renesas的大图  
 
70T3399S166BC     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3399S166BC
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   15664
 Inquiry Now
Characteristic    
Minqty   24
Series   IC SRAM 2MBIT PARALLEL 256CABGA
Packaging and Encapsulation   256-LBGA
Describe  
 
 
 
  •               Previous article
    AT27C2048-12JI
    Microchip Technology
    EPROM - OTP
  •               Next article
    70T659S12BCI8
    Renesas Electronics America Inc
    SRAM - 双端口，异步...
    •  
     
    BRAND
     
  •  
    XILINX
    1
     
     
  •  
    STMicroelectronics
    2
     
     
  •  
    Texas Instruments
    3
     
     
  •  
    Maxim
    4
     
     
  •  
    BROADCOM
    5
     
     
  •  
    Analog Devices Inc
    6
     
     
  •  
    Microchip
    7
     
     
  •  
    Silicon Labs
    8
     
     
  •  
    ALTERA
    9
     
     
  •  
    ON Semiconductor
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd