Image


70T3589S166BF

Die&wafer services

    Renesas Electronics America IncBranded70T3589S166BFIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70T3589S166BFChip inventory is11972individual。
---
 
Die&wafer services

70T3589S166BF
查看芯片与晶圆服务型号为70T3589S166BF，品牌为Renesas的大图  
 
70T3589S166BF     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3589S166BF
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11972
 Inquiry Now
Characteristic    
Minqty   21
Series   IC SRAM 2MBIT PARALLEL 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
  •               Previous article
    AT27C2048-12JC
    Microchip Technology
    EPROM - OTP
  •               Next article
    70T631S12BCI8
    Renesas Electronics America Inc
    SRAM - 双端口，异步...
    •  
     
    BRAND
     
  •  
    NXP Semiconductors
    1
     
     
  •  
    Analog Devices Inc
    2
     
     
  •  
    Silicon Labs
    3
     
     
  •  
    ON Semiconductor
    4
     
     
  •  
    ALTERA
    5
     
     
  •  
    Maxim
    6
     
     
  •  
    XILINX
    7
     
     
  •  
    Texas Instruments
    8
     
     
  •  
    BROADCOM
    9
     
     
  •  
    STMicroelectronics
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd