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70V7339S166BFG8

Die&wafer services

    Renesas Electronics America IncBranded70V7339S166BFG8Integrated circuit electronic chips use1000Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V7339S166BFG8Chip inventory is19357individual。
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Die&wafer services

70V7339S166BFG8
查看芯片与晶圆服务型号为70V7339S166BFG8，品牌为Renesas的大图  
 
70V7339S166BFG8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V7339S166BFG8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19357
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Characteristic    
Minqty   1000
Series   IC SRAM 9MBIT PARALLEL 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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