Image


70V7519S166BF

Die&wafer services

    Renesas Electronics America IncBranded70V7519S166BFIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V7519S166BFChip inventory is11131individual。
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Die&wafer services

70V7519S166BF
查看芯片与晶圆服务型号为70V7519S166BF，品牌为Renesas的大图  
 
70V7519S166BF     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V7519S166BF
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11131
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Characteristic    
Minqty   21
Series   IC SRAM 9MBIT PARALLEL 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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