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70T3719MS166BBG

Die&wafer services

    Renesas Electronics America IncBranded70T3719MS166BBGIntegrated circuit electronic chips use20Encapsulated, with a working temperature range of,The voltage is,use324-BGAPackaging technology，now70T3719MS166BBGChip inventory is12733individual。
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Die&wafer services

70T3719MS166BBG
查看芯片与晶圆服务型号为70T3719MS166BBG，品牌为Renesas的大图  
 
70T3719MS166BBG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3719MS166BBG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   12733
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Characteristic    
Minqty   20
Series   IC SRAM 18MBIT PARALLEL 324PBGA
Packaging and Encapsulation   324-BGA
Describe  
 
 
 
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