Image


70V631S10BFG

Die&wafer services

    Renesas Electronics America IncBranded70V631S10BFGIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V631S10BFGChip inventory is16984individual。
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Die&wafer services

70V631S10BFG
查看芯片与晶圆服务型号为70V631S10BFG，品牌为Renesas的大图  
 
70V631S10BFG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V631S10BFG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   16984
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Characteristic    
Minqty   21
Series   IC SRAM 4.5MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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