Image


70V3319S166BFG

Die&wafer services

    Renesas Electronics America IncBranded70V3319S166BFGIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V3319S166BFGChip inventory is18147individual。
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Die&wafer services

70V3319S166BFG
查看芯片与晶圆服务型号为70V3319S166BFG，品牌为Renesas的大图  
 
70V3319S166BFG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V3319S166BFG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   18147
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Characteristic    
Minqty   21
Series   IC SRAM 4.5MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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