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70V3319S166BF8

Die&wafer services

    Renesas Electronics America IncBranded70V3319S166BF8Integrated circuit electronic chips use1000Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V3319S166BF8Chip inventory is14867individual。
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Die&wafer services

70V3319S166BF8
查看芯片与晶圆服务型号为70V3319S166BF8，品牌为Renesas的大图  
 
70V3319S166BF8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V3319S166BF8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   14867
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Characteristic    
Minqty   1000
Series   IC SRAM 4.5MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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