Image


70T3539MS133BCG

Die&wafer services

    Renesas Electronics America IncBranded70T3539MS133BCGIntegrated circuit electronic chips use18Encapsulated, with a working temperature range of,The voltage is,use256-LBGAPackaging technology，now70T3539MS133BCGChip inventory is16051individual。
---
 
Die&wafer services

70T3539MS133BCG
查看芯片与晶圆服务型号为70T3539MS133BCG，品牌为Renesas的大图  
 
70T3539MS133BCG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3539MS133BCG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   16051
 Inquiry Now
Characteristic    
Minqty   18
Series   IC SRAM 18MBIT PAR 256CABGA
Packaging and Encapsulation   256-LBGA
Describe  
 
 
 
  •               Previous article
    CY14B116N-BZ25XIT
    Infineon Technologies
    NVSRAM（非易失性 SRAM）...
  •               Next article
    70T631S10BF8
    Renesas Electronics America Inc
    SRAM - 双端口，异步...
    •  
     
    BRAND
     
  •  
    XILINX
    1
     
     
  •  
    Silicon Labs
    2
     
     
  •  
    ON Semiconductor
    3
     
     
  •  
    ALTERA
    4
     
     
  •  
    Texas Instruments
    5
     
     
  •  
    STMicroelectronics
    6
     
     
  •  
    BROADCOM
    7
     
     
  •  
    Microchip
    8
     
     
  •  
    Analog Devices Inc
    9
     
     
  •  
    Maxim
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd