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70T3719MS133BBG

Die&wafer services

    Renesas Electronics America IncBranded70T3719MS133BBGIntegrated circuit electronic chips use20Encapsulated, with a working temperature range of,The voltage is,use324-BGAPackaging technology,now70T3719MS133BBGChip inventory is15637individual。
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Die&wafer services

70T3719MS133BBG

查看芯片与晶圆服务型号为70T3719MS133BBG,品牌为Renesas的大图  
 
70T3719MS133BBG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3719MS133BBG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   15637
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Characteristic    
Minqty   20
Series   IC SRAM 18MBIT PARALLEL 324PBGA
Packaging and Encapsulation   324-BGA
Describe  
 
 
 
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