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71T75602S166BGGI

Die&wafer services

    Renesas Electronics America IncBranded71T75602S166BGGIIntegrated circuit electronic chips use84Encapsulated, with a working temperature range of,The voltage is,use119-BGAPackaging technology，now71T75602S166BGGIChip inventory is13941individual。
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Die&wafer services

71T75602S166BGGI
查看芯片与晶圆服务型号为71T75602S166BGGI，品牌为Renesas的大图  
 
71T75602S166BGGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   71T75602S166BGGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   13941
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Characteristic    
Minqty   84
Series   IC SRAM 18MBIT PARALLEL 119PBGA
Packaging and Encapsulation   119-BGA
Describe  
 
 
 
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