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70V3579S4BFG

Die&wafer services

    Renesas Electronics America IncBranded70V3579S4BFGIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V3579S4BFGChip inventory is19856individual。
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Die&wafer services

70V3579S4BFG
查看芯片与晶圆服务型号为70V3579S4BFG，品牌为Renesas的大图  
 
70V3579S4BFG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V3579S4BFG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19856
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Characteristic    
Minqty   21
Series   IC SRAM 1.125MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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