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70T3799MS133BBGI

Die&wafer services

    Renesas Electronics America IncBranded70T3799MS133BBGIIntegrated circuit electronic chips use20Encapsulated, with a working temperature range of,The voltage is,use324-BGAPackaging technology，now70T3799MS133BBGIChip inventory is13942individual。
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Die&wafer services

70T3799MS133BBGI
查看芯片与晶圆服务型号为70T3799MS133BBGI，品牌为Renesas的大图  
 
70T3799MS133BBGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3799MS133BBGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   13942
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Characteristic    
Minqty   20
Series   IC SRAM 9MBIT PARALLEL 324PBGA
Packaging and Encapsulation   324-BGA
Describe  
 
 
 
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