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70T633S12BFGI

Die&wafer services

    Renesas Electronics America IncBranded70T633S12BFGIIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70T633S12BFGIChip inventory is11312individual。
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Die&wafer services

70T633S12BFGI
查看芯片与晶圆服务型号为70T633S12BFGI，品牌为Renesas的大图  
 
70T633S12BFGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T633S12BFGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11312
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Characteristic    
Minqty   21
Series   IC SRAM 9MBIT PARALLEL 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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