Image


70T633S12BFI

Die&wafer services

    Renesas Electronics America IncBranded70T633S12BFIIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70T633S12BFIChip inventory is19240individual。
---
 
Die&wafer services

70T633S12BFI
查看芯片与晶圆服务型号为70T633S12BFI，品牌为Renesas的大图  
 
70T633S12BFI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T633S12BFI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19240
 Inquiry Now
Characteristic    
Minqty   21
Series   IC SRAM 9MBIT PARALLEL 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
  •               Previous article
    S26HS02GTFPBHM053
    Infineon Technologies
    FLASH - NOR（SLC）
  •               Next article
    MT62F3G32D8DV-023 WT:B
    Micron Technology Inc.
    SDRAM - 移动 LPDDR5...
    •  
     
    BRAND
     
  •  
    STMicroelectronics
    1
     
     
  •  
    XILINX
    2
     
     
  •  
    Analog Devices Inc
    3
     
     
  •  
    Texas Instruments
    4
     
     
  •  
    ON Semiconductor
    5
     
     
  •  
    ALTERA
    6
     
     
  •  
    BROADCOM
    7
     
     
  •  
    Maxim
    8
     
     
  •  
    Silicon Labs
    9
     
     
  •  
    NXP Semiconductors
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd