Image


70T3799MS166BBG

Die&wafer services

    Renesas Electronics America IncBranded70T3799MS166BBGIntegrated circuit electronic chips use20Encapsulated, with a working temperature range of,The voltage is,use324-BGAPackaging technology，now70T3799MS166BBGChip inventory is11011individual。
---
 
Die&wafer services

70T3799MS166BBG
查看芯片与晶圆服务型号为70T3799MS166BBG，品牌为Renesas的大图  
 
70T3799MS166BBG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3799MS166BBG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11011
 Inquiry Now
Characteristic    
Minqty   20
Series   IC SRAM 9MBIT PARALLEL 324PBGA
Packaging and Encapsulation   324-BGA
Describe  
 
 
 
  •               Previous article
    CY7C1440KV25-250BZXIT
    Infineon Technologies
    SRAM - 同步，SDR
  •               Next article
    MT62F2G32D4DS-026 WT:B
    Micron Technology Inc.
    SDRAM - 移动 LPDDR5...
    •  
     
    BRAND
     
  •  
    STMicroelectronics
    1
     
     
  •  
    ON Semiconductor
    2
     
     
  •  
    Analog Devices Inc
    3
     
     
  •  
    Maxim
    4
     
     
  •  
    Silicon Labs
    5
     
     
  •  
    ALTERA
    6
     
     
  •  
    BROADCOM
    7
     
     
  •  
    NXP Semiconductors
    8
     
     
  •  
    Texas Instruments
    9
     
     
  •  
    Microchip
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd