Image


70V3579S6BF

Die&wafer services

    Renesas Electronics America IncBranded70V3579S6BFIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V3579S6BFChip inventory is12313individual。
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Die&wafer services

70V3579S6BF
查看芯片与晶圆服务型号为70V3579S6BF，品牌为Renesas的大图  
 
70V3579S6BF     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V3579S6BF
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   12313
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Characteristic    
Minqty   21
Series   IC SRAM 1.125MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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