Image


71T75602S100BGG

Die&wafer services

    Renesas Electronics America IncBranded71T75602S100BGGIntegrated circuit electronic chips use84Encapsulated, with a working temperature range of,The voltage is,use119-BGAPackaging technology，now71T75602S100BGGChip inventory is16482individual。
---
 
Die&wafer services

71T75602S100BGG
查看芯片与晶圆服务型号为71T75602S100BGG，品牌为Renesas的大图  
 
71T75602S100BGG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   71T75602S100BGG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   16482
 Inquiry Now
Characteristic    
Minqty   84
Series   IC SRAM 18MBIT PAR 119PBGA
Packaging and Encapsulation   119-BGA
Describe  
 
 
 
  •               Previous article
    CY7C006A-20AC
    Infineon Technologies
    SRAM - 双端口，异步...
  •               Next article
    MT53E4G32D8GS-046 WT ES:C TR
    Micron Technology Inc.
    SDRAM - Mobile LPDDR4...
    •  
     
    BRAND
     
  •  
    XILINX
    1
     
     
  •  
    ALTERA
    2
     
     
  •  
    Maxim
    3
     
     
  •  
    NXP Semiconductors
    4
     
     
  •  
    Silicon Labs
    5
     
     
  •  
    STMicroelectronics
    6
     
     
  •  
    Texas Instruments
    7
     
     
  •  
    BROADCOM
    8
     
     
  •  
    Analog Devices Inc
    9
     
     
  •  
    ON Semiconductor
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd