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70V3579S6BF8

Die&wafer services

    Renesas Electronics America IncBranded70V3579S6BF8Integrated circuit electronic chips use1000Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology,now70V3579S6BF8Chip inventory is11402individual。
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Die&wafer services

70V3579S6BF8

查看芯片与晶圆服务型号为70V3579S6BF8,品牌为Renesas的大图  
 
70V3579S6BF8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V3579S6BF8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11402
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Characteristic    
Minqty   1000
Series   IC SRAM 1.125MBIT PAR 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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