Image


MR0A08BCYS35

Die&wafer services

    Everspin Technologies Inc.BrandedMR0A08BCYS35Integrated circuit electronic chips use270Encapsulated, with a working temperature range of,The voltage is,use44-TSOP(0.400",10.16mm 宽)Packaging technology,nowMR0A08BCYS35Chip inventory is17422individual。
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Die&wafer services

MR0A08BCYS35

查看芯片与晶圆服务型号为MR0A08BCYS35,品牌为Everspin的大图  
 
MR0A08BCYS35     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MR0A08BCYS35
Brand   Everspin
Manufacturer   Everspin Technologies Inc.
PDF   Viewing PDF files
Inventory quantity   17422
 Inquiry Now
Characteristic    
Minqty   270
Series   IC RAM 1MBIT PARALLEL 44TSOP2
Packaging and Encapsulation   44-TSOP(0.400",10.16mm 宽)
Describe  
 
 
 
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