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CY62167G30-55ZXET

Die&wafer services

    Infineon TechnologiesBrandedCY62167G30-55ZXETIntegrated circuit electronic chips use1000Encapsulated, with a working temperature range of,The voltage is,use48-TFSOP（0.724"，18.40mm 宽）Packaging technology，nowCY62167G30-55ZXETChip inventory is15000individual。
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Die&wafer services

CY62167G30-55ZXET
查看芯片与晶圆服务型号为CY62167G30-55ZXET，品牌为Infineon的大图  
 
CY62167G30-55ZXET     There is sufficient supply and supply is ongoing...
Chip Information    
Model   CY62167G30-55ZXET
Brand   Infineon
Manufacturer   Infineon Technologies
PDF   Viewing PDF files
Inventory quantity   15000
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Characteristic    
Minqty   1000
Series   IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging and Encapsulation   48-TFSOP（0.724"，18.40mm 宽）
Describe  
 
 
 
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