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70T3339S200BCG

Die&wafer services

    Renesas Electronics America IncBranded70T3339S200BCGIntegrated circuit electronic chips use24Encapsulated, with a working temperature range of,The voltage is,use256-LBGAPackaging technology，now70T3339S200BCGChip inventory is19216individual。
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Die&wafer services

70T3339S200BCG
查看芯片与晶圆服务型号为70T3339S200BCG，品牌为Renesas的大图  
 
70T3339S200BCG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3339S200BCG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19216
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Characteristic    
Minqty   24
Series   IC SRAM 9MBIT PARALLEL 256CABGA
Packaging and Encapsulation   256-LBGA
Describe  
 
 
 
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