Image


70T3339S200BC

Die&wafer services

    Renesas Electronics America IncBranded70T3339S200BCIntegrated circuit electronic chips use24Encapsulated, with a working temperature range of,The voltage is,use256-LBGAPackaging technology，now70T3339S200BCChip inventory is12060individual。
---
 
Die&wafer services

70T3339S200BC
查看芯片与晶圆服务型号为70T3339S200BC，品牌为Renesas的大图  
 
70T3339S200BC     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3339S200BC
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   12060
 Inquiry Now
Characteristic    
Minqty   24
Series   IC SRAM 9MBIT PARALLEL 256CABGA
Packaging and Encapsulation   256-LBGA
Describe  
 
 
 
  •               Previous article
    S29GL512T11TFB023
    Infineon Technologies
    FLASH - NOR
  •               Next article
    MT29F2T08EMLEEJ4-T:E TR
    Micron Technology Inc.
    FLASH - NAND（TLC）...
    •  
     
    BRAND
     
  •  
    Texas Instruments
    1
     
     
  •  
    STMicroelectronics
    2
     
     
  •  
    Silicon Labs
    3
     
     
  •  
    NXP Semiconductors
    4
     
     
  •  
    Analog Devices Inc
    5
     
     
  •  
    Maxim
    6
     
     
  •  
    BROADCOM
    7
     
     
  •  
    XILINX
    8
     
     
  •  
    ALTERA
    9
     
     
  •  
    Microchip
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd