Image


70T3339S166BF

Die&wafer services

    Renesas Electronics America IncBranded70T3339S166BFIntegrated circuit electronic chips use21Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology,now70T3339S166BFChip inventory is12120individual。
---
 
Die&wafer services

70T3339S166BF

查看芯片与晶圆服务型号为70T3339S166BF,品牌为Renesas的大图  
 
70T3339S166BF     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3339S166BF
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   12120
 Inquiry Now
Characteristic    
Minqty   21
Series   IC SRAM 9MBIT PARALLEL 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
  •               Previous article
    71V3579S65PFG8
    Renesas Electronics America Inc
    SRAM - 同步,SDR
  •               Next article
    7005L15PFG
    Renesas Electronics America Inc
    SRAM - 双端口,异步...
  •  
     
    BRAND
     
  •  
    BROADCOM
    1
     
     
  •  
    Microchip
    2
     
     
  •  
    Maxim
    3
     
     
  •  
    STMicroelectronics
    4
     
     
  •  
    ON Semiconductor
    5
     
     
  •  
    Silicon Labs
    6
     
     
  •  
    Analog Devices Inc
    7
     
     
  •  
    XILINX
    8
     
     
  •  
    NXP Semiconductors
    9
     
     
  •  
    ALTERA
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd