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MT61K512M32KPA-16:C

Die&wafer services

    Micron Technology Inc.BrandedMT61K512M32KPA-16:CIntegrated circuit electronic chips use1260Encapsulated, with a working temperature range of,The voltage is,use180-TFBGAPackaging technology，nowMT61K512M32KPA-16:CChip inventory is12077individual。
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Die&wafer services

MT61K512M32KPA-16:C
查看芯片与晶圆服务型号为MT61K512M32KPA-16:C，品牌为Micron的大图  
 
MT61K512M32KPA-16:C     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MT61K512M32KPA-16:C
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   12077
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Characteristic    
Minqty   1260
Series   GDDR6 16G 512MX32 FBGA DDP
Packaging and Encapsulation   180-TFBGA
Describe  
 
 
 
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