Image


MR256A08BCYS35

Die&wafer services

    Everspin Technologies Inc.BrandedMR256A08BCYS35Integrated circuit electronic chips use270Encapsulated, with a working temperature range of,The voltage is,use44-TSOP(0.400",10.16mm 宽)Packaging technology,nowMR256A08BCYS35Chip inventory is17504individual。
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Die&wafer services

MR256A08BCYS35

查看芯片与晶圆服务型号为MR256A08BCYS35,品牌为Everspin的大图  
 
MR256A08BCYS35     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MR256A08BCYS35
Brand   Everspin
Manufacturer   Everspin Technologies Inc.
PDF   Viewing PDF files
Inventory quantity   17504
 Inquiry Now
Characteristic    
Minqty   270
Series   IC RAM 256KBIT PARALLEL 44TSOP2
Packaging and Encapsulation   44-TSOP(0.400",10.16mm 宽)
Describe  
 
 
 
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