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AT25DF512C-XMHNGU-B

Die&wafer services

    Adesto TechnologiesBrandedAT25DF512C-XMHNGU-BIntegrated circuit electronic chips use3900Encapsulated, with a working temperature range of,The voltage is,use8-TSSOP（0.173"，4.40mm 宽）Packaging technology，nowAT25DF512C-XMHNGU-BChip inventory is14809individual。
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Die&wafer services

AT25DF512C-XMHNGU-B
查看芯片与晶圆服务型号为AT25DF512C-XMHNGU-B，品牌为Adesto的大图  
 
AT25DF512C-XMHNGU-B     There is sufficient supply and supply is ongoing...
Chip Information    
Model   AT25DF512C-XMHNGU-B
Brand   Adesto
Manufacturer   Adesto Technologies
PDF   Viewing PDF files
Inventory quantity   14809
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Characteristic    
Minqty   3900
Series   IC FLASH 512KBIT SPI 8TSSOP
Packaging and Encapsulation   8-TSSOP（0.173"，4.40mm 宽）
Describe  
 
 
 
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