Image


S25FL128SAGBHI310

Die&wafer services

    Infineon TechnologiesBrandedS25FL128SAGBHI310Integrated circuit electronic chips use676Encapsulated, with a working temperature range of,The voltage is,use24-TBGAPackaging technology,nowS25FL128SAGBHI310Chip inventory is10430individual。
---
 
Die&wafer services

S25FL128SAGBHI310

查看芯片与晶圆服务型号为S25FL128SAGBHI310,品牌为Infineon的大图  
 
S25FL128SAGBHI310     There is sufficient supply and supply is ongoing...
Chip Information    
Model   S25FL128SAGBHI310
Brand   Infineon
Manufacturer   Infineon Technologies
PDF   Viewing PDF files
Inventory quantity   10430
 Inquiry Now
Characteristic    
Minqty   676
Series   IC FLASH 128MBIT SPI/QUAD 24BGA
Packaging and Encapsulation   24-TBGA
Describe  
 
 
 
  •               Previous article
    25LC320AT-I&MNY
    Microchip Technology
    EEPROM
  •               Next article
    25LC010AT-E&ST
    Microchip Technology
    EEPROM
  •  
     
    BRAND
     
  •  
    ALTERA
    1
     
     
  •  
    STMicroelectronics
    2
     
     
  •  
    NXP Semiconductors
    3
     
     
  •  
    Maxim
    4
     
     
  •  
    ON Semiconductor
    5
     
     
  •  
    Silicon Labs
    6
     
     
  •  
    Microchip
    7
     
     
  •  
    Analog Devices Inc
    8
     
     
  •  
    XILINX
    9
     
     
  •  
    Texas Instruments
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd