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S25FL256SAGBHI310

Die&wafer services

    Infineon TechnologiesBrandedS25FL256SAGBHI310Integrated circuit electronic chips use338Encapsulated, with a working temperature range of,The voltage is,use24-TBGAPackaging technology,nowS25FL256SAGBHI310Chip inventory is19002individual。
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Die&wafer services

S25FL256SAGBHI310

查看芯片与晶圆服务型号为S25FL256SAGBHI310,品牌为Infineon的大图  
 
S25FL256SAGBHI310     There is sufficient supply and supply is ongoing...
Chip Information    
Model   S25FL256SAGBHI310
Brand   Infineon
Manufacturer   Infineon Technologies
PDF   Viewing PDF files
Inventory quantity   19002
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Characteristic    
Minqty   338
Series   IC FLASH 256MBIT SPI/QUAD 24BGA
Packaging and Encapsulation   24-TBGA
Describe  
 
 
 
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