Image


M3008316035NX0IBCY

Die&wafer services

    Renesas Electronics America IncBrandedM3008316035NX0IBCYIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use48-LFBGAPackaging technology,nowM3008316035NX0IBCYChip inventory is14038individual。
---
 
Die&wafer services

M3008316035NX0IBCY

查看芯片与晶圆服务型号为M3008316035NX0IBCY,品牌为Renesas的大图  
 
M3008316035NX0IBCY     There is sufficient supply and supply is ongoing...
Chip Information    
Model   M3008316035NX0IBCY
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   14038
 Inquiry Now
Characteristic    
Minqty   1
Series   IC RAM 8MBIT PARALLEL 48FBGA
Packaging and Encapsulation   48-LFBGA
Describe  
 
 
 
  •               Previous article
    24AA014H-I&MS
    Microchip Technology
    EEPROM
  •               Next article
    CY7C1041GE30-10ZSXI
    Infineon Technologies
    SRAM - 异步
  •  
     
    BRAND
     
  •  
    ON Semiconductor
    1
     
     
  •  
    Maxim
    2
     
     
  •  
    Texas Instruments
    3
     
     
  •  
    ALTERA
    4
     
     
  •  
    Analog Devices Inc
    5
     
     
  •  
    STMicroelectronics
    6
     
     
  •  
    XILINX
    7
     
     
  •  
    NXP Semiconductors
    8
     
     
  •  
    Silicon Labs
    9
     
     
  •  
    BROADCOM
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd