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S25FS256TDACHC113

Die&wafer services

    Infineon TechnologiesBrandedS25FS256TDACHC113Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use33-XFBGA,WLCSPPackaging technology,nowS25FS256TDACHC113Chip inventory is16543individual。
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Die&wafer services

S25FS256TDACHC113

查看芯片与晶圆服务型号为S25FS256TDACHC113,品牌为Infineon的大图  
 
S25FS256TDACHC113     There is sufficient supply and supply is ongoing...
Chip Information    
Model   S25FS256TDACHC113
Brand   Infineon
Manufacturer   Infineon Technologies
PDF   Viewing PDF files
Inventory quantity   16543
 Inquiry Now
Characteristic    
Minqty   1
Series   256MB SEMPER NANO FLASH
Packaging and Encapsulation   33-XFBGA,WLCSP
Describe  
 
 
 
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