Image


70T3509MS133BPG

Die&wafer services

    Renesas Electronics America IncBranded70T3509MS133BPGIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use256-BGAPackaging technology，now70T3509MS133BPGChip inventory is19327individual。
---
 
Die&wafer services

70T3509MS133BPG
查看芯片与晶圆服务型号为70T3509MS133BPG，品牌为Renesas的大图  
 
70T3509MS133BPG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3509MS133BPG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19327
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 36MBIT PAR 256CABGA
Packaging and Encapsulation   256-BGA
Describe  
 
 
 
  •               Previous article
    23K640-E&P
    Microchip Technology
    SRAM
  •               Next article
    CAV24C256YE-GT3
    onsemi
    EEPROM
    •  
     
    BRAND
     
  •  
    Texas Instruments
    1
     
     
  •  
    Maxim
    2
     
     
  •  
    ON Semiconductor
    3
     
     
  •  
    BROADCOM
    4
     
     
  •  
    XILINX
    5
     
     
  •  
    STMicroelectronics
    6
     
     
  •  
    NXP Semiconductors
    7
     
     
  •  
    ALTERA
    8
     
     
  •  
    Silicon Labs
    9
     
     
  •  
    Analog Devices Inc
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd