Image


70V657S10BFG

Die&wafer services

    Renesas Electronics America IncBranded70V657S10BFGIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70V657S10BFGChip inventory is19138individual。
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Die&wafer services

70V657S10BFG
查看芯片与晶圆服务型号为70V657S10BFG，品牌为Renesas的大图  
 
70V657S10BFG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70V657S10BFG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19138
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Characteristic    
Minqty   1
Series   IC SRAM 1.125MBIT PAR 208FPBGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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