MR0A08BYS35
Die&wafer services
Everspin Technologies Inc.BrandedMR0A08BYS35Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use44-TSOP（0.400"，10.16mm 宽）Packaging technology，nowMR0A08BYS35Chip inventory is13931individual。
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