Image


MR256A08BYS35

Die&wafer services

    Everspin Technologies Inc.BrandedMR256A08BYS35Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use44-TSOP(0.400",10.16mm 宽)Packaging technology,nowMR256A08BYS35Chip inventory is18328individual。
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Die&wafer services

MR256A08BYS35

查看芯片与晶圆服务型号为MR256A08BYS35,品牌为Everspin的大图  
 
MR256A08BYS35     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MR256A08BYS35
Brand   Everspin
Manufacturer   Everspin Technologies Inc.
PDF   Viewing PDF files
Inventory quantity   18328
 Inquiry Now
Characteristic    
Minqty   1
Series   IC RAM 256KBIT PARALLEL 44TSOP2
Packaging and Encapsulation   44-TSOP(0.400",10.16mm 宽)
Describe  
 
 
 
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