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70T3509MS133BPI

Die&wafer services

    Renesas Electronics America IncBranded70T3509MS133BPIIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use256-BGAPackaging technology，now70T3509MS133BPIChip inventory is16077individual。
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Die&wafer services

70T3509MS133BPI
查看芯片与晶圆服务型号为70T3509MS133BPI，品牌为Renesas的大图  
 
70T3509MS133BPI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3509MS133BPI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   16077
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Characteristic    
Minqty   1
Series   IC SRAM 36MBIT PAR 256CABGA
Packaging and Encapsulation   256-BGA
Describe  
 
 
 
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