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MR25H10MDC

Die&wafer services

    Everspin Technologies Inc.BrandedMR25H10MDCIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use8-TDFN 裸露焊盘Packaging technology，nowMR25H10MDCChip inventory is10325individual。
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Die&wafer services

MR25H10MDC
查看芯片与晶圆服务型号为MR25H10MDC，品牌为Everspin的大图  
 
MR25H10MDC     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MR25H10MDC
Brand   Everspin
Manufacturer   Everspin Technologies Inc.
PDF   Viewing PDF files
Inventory quantity   10325
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Characteristic    
Minqty   1
Series   IC RAM 1MBIT SPI 40MHZ 8DFN
Packaging and Encapsulation   8-TDFN 裸露焊盘
Describe  
 
 
 
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