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LPC1113FHN33&302,5

Microcontrollers

    NXP USA Inc.BrandedLPC1113FHN33&302,5Integrated circuit electronic chips use260Encapsulated, with a working temperature range of-40°C ~ 85°C（TA）,The voltage is1.8V ~ 3.6V,use32-VQFN 裸露焊盘Packaging technology，nowLPC1113FHN33&302,5Chip inventory is13912individual。
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Microcontrollers

LPC1113FHN33&302,5
查看微处理型号为LPC1113FHN33&302,5，品牌为NXP的大图  
 
LPC1113FHN33&302,5     There is sufficient supply and supply is ongoing...
Chip Information    
Model   LPC1113FHN33&302,5
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   13912
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Characteristic    
Minqty   260
Series   IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging and Encapsulation   32-VQFN 裸露焊盘
Supply Voltage   1.8V ~ 3.6V
Operation Temperature   -40°C ~ 85°C（TA）
Speed   50MHz
Core processor   ARM® Cortex®-M0
RAM Size   8K x 8
Describe  
 
 
 
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