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SPAKXC309VF100A

Microcontrollers

    NXP USA Inc.BrandedSPAKXC309VF100AIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of-40°C ~ 105°C（TJ）,The voltage is3.30V,use196-LBGAPackaging technology，nowSPAKXC309VF100AChip inventory is16608individual。
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Microcontrollers

SPAKXC309VF100A
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SPAKXC309VF100A     There is sufficient supply and supply is ongoing...
Chip Information    
Model   SPAKXC309VF100A
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   16608
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Characteristic    
Minqty   1
Series   IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging and Encapsulation   196-LBGA
Supply Voltage   3.30V
Operation Temperature   -40°C ~ 105°C（TJ）
Architecture   MPU，FPGA
Core processor   带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™，ARM NEON，浮点
Memory Size   -
RAM Size   256KB
Describe  
 
 
 
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