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XC56309VF100AR2

Microcontrollers

    NXP USA Inc.BrandedXC56309VF100AR2Integrated circuit electronic chips use1Encapsulated, with a working temperature range of-40°C ~ 105°C（TJ）,The voltage is3.30V,use196-LBGAPackaging technology，nowXC56309VF100AR2Chip inventory is14146individual。
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Microcontrollers

XC56309VF100AR2
查看微处理型号为XC56309VF100AR2，品牌为NXP的大图  
 
XC56309VF100AR2     There is sufficient supply and supply is ongoing...
Chip Information    
Model   XC56309VF100AR2
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   14146
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Characteristic    
Minqty   1
Series   IC DSP 24BIT 100MHZ 196-MABGA
Packaging and Encapsulation   196-LBGA
Supply Voltage   3.30V
Operation Temperature   -40°C ~ 105°C（TJ）
Architecture   MPU，FPGA
Core processor   带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™，带 CoreSight™ 的双核 ARM®Cortex™-R5，ARM Mali™-400 MP2
Memory Size   -
RAM Size   256KB
Describe  
 
 
 
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