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XC56309AG100AR2

Microcontrollers

    NXP USA Inc.BrandedXC56309AG100AR2Integrated circuit electronic chips use1Encapsulated, with a working temperature range of-40°C ~ 105°C(TJ),The voltage is3.30V,use144-LQFPPackaging technology,nowXC56309AG100AR2Chip inventory is17140individual。
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Microcontrollers

XC56309AG100AR2

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XC56309AG100AR2     There is sufficient supply and supply is ongoing...
Chip Information    
Model   XC56309AG100AR2
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   17140
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Characteristic    
Minqty   1
Series   IC DSP 24BIT 100MHZ 144-LQFP
Packaging and Encapsulation   144-LQFP
Supply Voltage   3.30V
Operation Temperature   -40°C ~ 105°C(TJ)
Architecture   MPU,FPGA
Core processor   带 CoreSight™ 的双核 ARM® Cortex®-A53 MPCore™,带 CoreSight™ 的双核 ARM® Cortex™-R5
Memory Size   -
RAM Size   256KB
Describe  
 
 
 
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