MC33269DR2-3.3G
Power management
onsemiBrandedMC33269DR2-3.3GIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of-40°C ~ 125°C,The voltage is,use8-SOIC(0.154",3.90mm 宽)Packaging technology,nowMC33269DR2-3.3GChip inventory is10051individual。
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